HSEB ผู้ผลิตและจำหน่ายกล้องจุลทรรศน์อุตสาหกรรมฯคุณภาพสูงจากเยอรมัน (Carl Zeiss)

HSEB
Product	Description
	HSEB has developed from a pure development office into a comprehensive middle-sized production company with high scientific-technical potential. Since taking over the business field "Optical Wafer Inspection" from Carl Zeiss SMS in 2004, HSEB has been in a position to offer complete systems for macroscopic and microscopic inspection of wafers and wafer edges for all common wafer types.
	HSEB ผู้ผลิตและจำหน่ายกล้องจุลทรรศน์อุตสาหกรรมฯคุณภาพสูงจากCarl Zeiss,Germany และเครื่อง Automatic Wafer Inspection สำหรับโรงงานอุตสาหกรรมฯเซมิคอนดัสเตอร์ฯ, อิเลคโทรนิคส์และคอมพิวเตอร์.
	http://www.hseb-dresden.de/

 Below you can find a list of the most relevant applications for which our systems are suited. The list is not exhaustive, but it is intended as a quick guide to find the approriate product for your desired application.

 Alternatively you may browse the product categories for Systems and Modules, OEM and Stand-Alone Components or for Software. 

• Macro Inspection (MMT 300, MIT 301) 
  • scratches, particles, defocussing, ADI defects
  • bare wafer (incoming wafer QC) inspection
  • MEMS quality control

• Micro Inspection/Review (Axiospect 300, Axiospect 301, Axiospect 202, CSM VIS-UV)
  • manual defect classification e.g. of scanner data
  • scratches, particles, voids, vias, pads, pattern defects
  • defocussing, homogeneity 
  • topographic information
  • automatic optical review with defect recognition

• Metrology (Film Thickness measurement, CD Measurement)
  • thickness measurement of multiple (also buried) films
  • determination of optical properties of films (refractive index, material)
  • critical dimension, overlay and diameter measurement
  • complex CD measurements at different focus levels
  • alignment mark check

• MEMS Specific Applications (Axiotron 2, Axiospect 202)
  • infra-red microscopy for inspection and measurement of buried structures
  • inspection of bonded wafers
  • overlay measurement e.g. against alignment patterns at surface  
  • silicon membrane and air cavern thickness measurements

• Edge Inspection (EIS)
  • delamination, chipouts, cracks
  • EBR/WEE width and eccentricity measurement, tool evaluation
  • edge imaging with automatic defect detection and pre-classification

• F/A and R&D Lab Applications
  • versatile stand-alone microscopes for all common contrast techniques (Axiotron 2, CSM VIS-UV)
  • brightfield, darkfield, differential interference contrast (DIC), white-light confocal (CSM), fluorescence and polarization microscopy
  •  i-line, DUV and NIR microscopy
  • incident and transmitted light illumination
  • high-end optics by Carl Zeiss, objective range from 1,25x ... 150x